Microassembly of Heterogeneous Materials for the Manufacture of MEMs Devices
- 詳細技術說明
- Dr. Seok Kim from the University of Illinois at Urbana-Champaign has developed a method for assembling 3D architectures out of heterogeneous materials used to make MEMs devices.
- *Abstract
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Microassembly of Heterogeneous Materials for the Manufacture of MEMs DevicesDr. Seok Kim from the University of Illinois at Urbana-Champaign has developed a method for assembling 3D architectures out of heterogeneous materials used to make MEMs devices. His method uses new protocols for the making of SU8 and silicon oxide inks that can then be transfer printed and joined to other substrates including gold and silicon. This method is scalable and cuts down on waste compared to existing manufacturing processes. The ability to pick, place, and join 3D structures can enable to device designs for increasing small and complex MEMs devices.
For more information, contact the Office of Technology Management at otm@illinois.edu.
- *IP Issue Date
- None
- *IP Type
- Other Patent
- 國家
- Not Available
- 申請號碼
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- 國家/地區
- 美國
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