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A Direct-Write Microplasma Sputtering System For 2D and 3D Additive Manufacturing of Micro and Nanosystems

詳細技術說明

Background:Traditionally, sputtering has been one step in a multi-step subtractive manufacturing process: it has been used to bulk coat substrates which are then etched to create the circuit patte

*Abstract

Background:Traditionally, sputtering has been one step in a multi-step subtractive manufacturing process: it has been used to bulk coat substrates which are then etched to create the circuit pattern. The process developed in this patent eliminates the need for etching and the associated wet processing, post-baking, waste production chemical and labor intensive work through the direct creation of a high-quality line conductive trace using any conductor, on any substrate.Technology Overview:The developed technology is a direct-write micro-plasma sputtering process for making 2D and 3D structures. A working, first generation prototype exists and is being used to study application in multiple areas of industrial importance.The system works as follows. High voltage applied to the system accelerates ions towards a target. The ions dislodge material from the target through a sputtering process. Once this discharge has formed, a magnetic field acts on the plasma. The field causes the plasma to swirl about the target. The result is a uniform deposit on the substrate. Patterns are created on the substrate via a computer controlled mechanical stage.Benefits:-- Single step process: No solvents, no capping agents or binders and no post-baking or other post-processing-- Exceptionally low waste-- Scalable from small to large production, 2D or 3D-- Operates at atmospheric pressure-- Massive variety of materials: any conductor, any substrate (glass, plastics, ceramics, etc.)-- 3X better conductivity, 3X better uniformity trace than any other additive method-- Outstanding line width fidelity and definition-- Disruptive, enables new-to-the-world customer applications, including microelectronic sensors, MEMs devices & packaging.

國家/地區

美國