Phosphor-Free White Light Source
- 技術優勢
- The light-emitting layer in a semiconductor device is deposited on a textured surface. Allows for higher material quality and improved light extraction efficiency. Achieves higher-quality UV to infrared light-emitting devices than are currently achievable by conventional methods.
- 技術應用
- Nitride-based lighting This technology is available for licensing.
- 詳細技術說明
- Researchers at the University of California, Santa Barbara have developed a phosphor-free white light source, where an indium-containing light-emitting layer, as well as subsequent device layers, is deposited on a textured surface. It is possible to develop a device with suitably textured areas that would emit at two or more peak wavelengths, where both peak emission wavelengths are produced primarily from the indium-containing light-emitting layer.
- *Abstract
-
A phosphor-free white light source, where an indium-containing light-emitting layer, as well as subsequent device layers, is deposited on a textured surface.
- *Applications
-
- Nitride-based lighting
- *IP Issue Date
- Jul 24, 2012
- *Principal Investigation
-
Name: John Kaeding
Department:
Name: Shuji Nakamura
Department:
Name: Paul Pattison
Department:
Name: Rajat Sharma
Department:
- 附加資料
- Patent Number: US8227820B2
Application Number: US200554271A
Inventor: Sharma, Rajat | Pattison, Paul Morgan | Kaeding, John Francis | Nakamura, Shuji
Priority Date: 9 Feb 2005
Priority Number: US8227820B2
Application Date: 9 Feb 2005
Publication Date: 24 Jul 2012
IPC Current: H01L003300 | H01L003322
US Class: 257095 | 257089 | 257090 | 257103 | 257E33028 | 257E33034 | 438042 | 438047
Assignee Applicant: The Regents of the University of California
Title: Semiconductor light-emitting device
Usefulness: Semiconductor light-emitting device
Summary: For manufacturing semiconductor light-emitting device.
Novelty: Semiconductor light-emitting device manufacture method involves depositing indium containing light-emitting layer and subsequent device layer on textured surface
- 主要類別
- 光學
- 細分類別
- 發光二極管/有機發光二極管
- 申請號碼
- 8227820
- 其他
-
Background
Typical incandescent light sources, while highly energy-inefficient, have a desirable characteristic broad-emission spectrum and a high color-rendering index. In order to mimic these latter attributes in gallium nitride (GaN) based devices, current state-of-the-art designs have certain disadvantages. The process of down-conversion is inherently inefficient due to the Stokes shift and poor conversion efficiency. The emission spectrum and intensity are highly sensitive to spatial variations in the phosphor composition and thickness, and may vary greatly with emission direction. Finally, while the diode itself may have a long lifetime, phosphors typically degrade with time, resulting in a variation of the emission spectrum with time. Current designs proposing methods to obtain "white" light without the aid of phosphors typically rely on a high-indium content layer deposited under conditions that result in poor material quality.
Additional Technologies by these Inventors
- Reduced Dislocation Density of Non-Polar GaN Grown by Hydride Vapor Phase Epitaxy
- Growth of Planar, Non-Polar, A-Plane GaN by Hydride Vapor Phase Epitaxy
- Improved Manufacturing of Semiconductor Lasers
- Cleaved Facet Edge-Emitting Laser Diodes Grown on Semipolar GaN
- Etching Technique for the Fabrication of Thin (Al, In, Ga)N Layers
- Enhancing Growth of Semipolar (Al,In,Ga,B)N Films via MOCVD
- GaN-Based Thermoelectric Device for Micro-Power Generation
- Growth of High-Quality, Thick, Non-Polar M-Plane GaN Films
- Method for Growing High-Quality Group III-Nitride Crystals
- Growth of Planar Semi-Polar Gallium Nitride
- MOCVD Growth of Planar Non-Polar M-Plane Gallium Nitride
- Lateral Growth Method for Defect Reduction of Semipolar Nitride Films
- Low Temperature Deposition of Magnesium Doped Nitride Films
- Growth of Polyhedron-Shaped Gallium Nitride Bulk Crystals
- Control of Photoelectrochemical (PEC) Etching by Modification of the Local Electrochemical Potential of the Semiconductor Structure
- Packaging Technique for the Fabrication of Polarized Light Emitting Diodes
- LED Device Structures with Minimized Light Re-Absorption
- III-V Nitride Device Structures on Patterned Substrates
- Growth of Semipolar III-V Nitride Films with Lower Defect Density
- Improved GaN Substrates Prepared with Ammonothermal Growth
- Enhanced Optical Polarization of Nitride LEDs by Increased Indium Incorporation
- Semipolar-Based Yellow, Green, Blue LEDs with Improved Performance
- Hexagonal Wurtzite Type Epitaxial Layer with a Low Alkali-Metal Concentration
- Photoelectrochemical Etching Of P-Type Semiconductor Heterostructures
- Highly Efficient Blue-Violet III-Nitride Semipolar Laser Diodes
- Method for Manufacturing Improved III-Nitride LEDs and Laser Diodes: Monolithic Integration of Optically Pumped and Electrically Injected III-Nitride LEDs
- Semi-polar LED/LD Devices on Relaxed Template with Misfit Dislocation at Hetero-interface
- Limiting Strain-Relaxation in III-Nitride Heterostructures by Substrate Patterning
- Suppression of Defect Formation and Increase in Critical Thickness by Silicon Doping
- High Efficiency Semipolar AlGaN-Cladding-Free Laser Diodes
- Low-Cost Zinc Oxide for High-Power-Output, GaN-Based LEDs (UC Case 2010-183)
- Low-Cost Zinc Oxide for High-Power-Output, GaN-Based LEDs (UC Case 2010-150)
- Nonpolar III-Nitride LEDs With Long Wavelength Emission
- Method for Increasing GaN Substrate Area in Nitride Devices
- Flexible Arrays of MicroLEDs using the Photoelectrochemical (PEC) Liftoff Technique
- Optimization of Laser Bar Orientation for Nonpolar Laser Diodes
- UV Optoelectronic Devices Based on Nonpolar and Semi-polar AlInN and AlInGaN Alloys
- Low-Droop LED Structure on GaN Semi-polar Substrates
- Improved Fabrication of Nonpolar InGaN Thin Films, Heterostructures, and Devices
- Growth of High-Performance M-plane GaN Optical Devices
- Method for Enhancing Growth of Semipolar Nitride Devices
- Transparent Mirrorless (TML) LEDs
- Technique for the Nitride Growth of Semipolar Thin Films, Heterostructures, and Semiconductor Devices
- Planar, Nonpolar M-Plane III-Nitride Films Grown on Miscut Substrates
- High-Efficiency, Mirrorless Non-Polar and Semi-Polar Light Emitting Devices
- High Light Extraction Efficiency III-Nitride LED
- Tunable White Light Based on Polarization-Sensitive LEDs
- Method for Improved Surface of (Ga,Al,In,B)N Films on Nonpolar or Semipolar Subtrates
- Improved Anisotropic Strain Control in Semipolar Nitride Devices
- III-Nitride Tunnel Junction with Modified Interface
- Hybrid Growth Method for Improved III-Nitride Tunnel Junction Devices
- Contact Architectures for Tunnel Junction Devices
- Internal Heating for Ammonothermal Growth of Group-III Nitride Crystals
- Methods for Fabricating III-Nitride Tunnel Junction Devices
- Multifaceted III-Nitride Surface-Emitting Laser
- Laser Diode System For Horticultural Lighting
- Fabricating Nitride Layers
- Vertical Cavity Surface-Emitting Lasers with Continuous Wave Operation
- Laser Lighting System Incorporating an Additional Scattered Laser
Tech ID/UC Case
22786/2004-208-0
Related Cases
2004-208-0
- 國家/地區
- 美國
