Stiction Repair for MEMS Structures and Devices
- 詳細技術說明
- A non-contact process has been developed to over come the MEMS stiction problem. Laser spallation is an innovative technology for de-adhering and measuring adhesion strength of film and multilayer film interfaces. Typically, a nanosecond duration pulse from a Nd:YAG laser is used to launch a compressive stress wave into the substrate. This compressive stress wave travels through the substrate and film. Upon reaching the free surface it is reflected as a tensile wave. It is this tensile wave, that upon reaching the thin film interface, releases the film from the substrate. A similar methodology can be used to free stiction-failed MEMS devices.
- *Abstract
-
UCLA researchers in the Mechanical and Aerospace Engineering Department have Developed, Reduced-to-Practice and Characterized a Innovative Process to Release Stiction Failures in Micro-Electro-Mechanical Systems (MEMS) Devices
- *IP Issue Date
- Oct 14, 2008
- *Principal Investigation
-
Name: Vijay Gupta
Department:
- 附加資料
- Patent Number: US7435611B2
Application Number: US2006511858A
Inventor: Gupta, Vijay
Priority Date: 5 Mar 2004
Priority Number: US7435611B2
Application Date: 28 Aug 2006
Publication Date: 14 Oct 2008
IPC Current: H01L002100
US Class: 438048 | 438050 | 438052
Assignee Applicant: The Regents of the University of California
Title: Laser generated stress waves for stiction repair
Usefulness: Laser generated stress waves for stiction repair
Summary: For releasing stiction between suspended structures and underlying surface in freestanding micro electro mechanical system (MEMS) structure during manufacture of MEMS device.
Novelty: Stiction releasing method in micro electro mechanical system device manufacture, involves propagating stress wave from back surface of substrate to front surface to release stiction of suspended microstructure at front surface
- 主要類別
- 電子
- 細分類別
- 半導體
- 申請號碼
- 7435611
- 其他
-
State of Development
Cantilevered beams were fabricated using a standard MEMS process with the exception of the special release process used after the final isopropyl rinse. The beam length varied from 100 -1000 um and the substrate separation was 2 or 4.5 um. A Nd:YAG laser was focused to a 3mm diameter spot on the back of the substrate to generate the stress wave. Cantilevered beams were released starting at 7kJ/m^2 and additional beams were released as the beam energy was increased. Typical beam release times were a few seconds of laser exposure.
Background
Stiction (adhesion of suspended structures and the underlying surface) is a considerable problem for batch fabricated MEMS devices. MEMS devices are often released through wet etching. As the wafer is removed from the wet etch, liquid is trapped between the small space separating the MEMS device and the substrate. This liquid, through capillary forces, pulls the cantilevered MEMS device down to the substrate where it remains. Numerous techniques have been explored to resolve this problem. However, most require significant trade-offs e.g. non-standard silicon processing, additional design structures, long release process times, etc.
Additional Technologies by these Inventors
- Material for Mitigating Impact Forces with Collision Durations in Nanoseconds to Milliseconds Range
- Composite Foam
Tech ID/UC Case
20297/2004-003-0
Related Cases
2004-003-0
- 國家/地區
- 美國
