ELECTROLYTIC DEPOSITION OF COPPER ONTO ALUMINUM
- 詳細技術說明
- None
- *Abstract
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Non-Confidential Abstract of Invention: A process has been developed which allows a good quality, uniform adherent deposit of copper to be spontaneously placed on an aluminum film. The reaction occurs directly in a suitable organic media which is not a good electrolyte.
- *Principal Investigation
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Name: Thomas O'Keefe, Curatorss' Professor Emeritus
Department:
Name: Matthew O'Keefe, Professor, Chem Engr; Executive Director (CME)
Department:
- 其他
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- 國家/地區
- 美國
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