Hybrid Integrated Thermal Electric and Ejector Active Cooling System
- 標題
- HYBRID THERMOELECTRIC-EJECTOR COOLING SYSTEM
- 詳細技術說明
- None
- *Abstract
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University of MissouriOffice of Technology Management & Industry RelationsNon-Confidential Abstract of InventionUM Disclosure No. 10UMC009HYBRID INTERGRATED THERMAL ELECTRIC AND EJECTOR ACTIVE COOLING SYTEMThe current active thermal electric cooling system being used for electronic components or systems has a low coefficient of performance (COP) which directly limits the application. The invention is a hybrid of both thermal electric and ejector refrigeration systems which can significantly increase the COP of the active cooling system. And it has no moving parts and the effect of the temperature difference across the thermal electric cooling module on the system COP can be significantly reduced. POTENTIAL AREAS OF APPLICATIONS:• Electronic cooling• Computer chip thermal management• Laser coolingMAIN ADVANTAGES OF INVENTION:• Provides a much higher coefficient of performance than state-of-the-art thermal electric cooling modulesPOSSIBLE DISADVANTAGES OF INVENTION:• None as of yetSTATE OF DEVELOPMENT:• Written descriptionFURTHER R&D REQUIRED• Development of a prototypeLICENSING POTENTIAL:• University seeks licensee with the potential to commercializePATENT STATUS:• Provisional patent application on fileINVENTOR(S):• Hongbin Ma, Peng Cheng, Joe BoswellCONTACT INFO: Office of Technology Management & Industry Relations Wayne C. McDaniel, Ph.D. Senior Licensing & Business Development Associate – Engineering and Physical Sciences Email: McDanielwc@missouri.edu Phone: 573-884-3302
- *IP Issue Date
- Jul 1, 2014
- *IP Publication Date
- Apr 7, 2011
- *Principal Investigation
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Name: Hongbin Ma, Asoc Prof Mech & Aerospace Engineering
Department:
Name: Pengyin Chen
Department:
Name: Joe Boswell, General Manager
Department:
- 申請日期
- Oct 1, 2010
- 申請號碼
- 8,763,408
- 其他
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- 國家/地區
- 美國
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