Negative Pressure Amputation Wound Closure Device
- 詳細技術說明
- The invention describes systems, devices, and methods to accelerate and reduce medical complications associated with healing of amputation wounds. The devices and methodsutilize a compression struct
- *Abstract
-
The invention describes systems, devices, and methods to accelerate and reduce medical complications associated with healing of amputation wounds. The devices and methodsutilize a compression structure and negative pressure to cause the amputation wound to preferentially close from the deepest portion of the wound to the shallowest portion.
- *IP Issue Date
- None
- *IP Type
- Other Patent
- 國家
- Not Available
- 申請號碼
- None
- 國家/地區
- 美國
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