亞洲知識產權資訊網為知識產權業界提供一個一站式網上交易平台,協助業界發掘知識產權貿易商機,並與環球知識產權業界建立聯繫。無論你是知識產權擁有者正在出售您的知識產權,或是製造商需要購買技術以提高操作效能,又或是知識產權配套服務供應商,你將會從本網站發掘到有用的知識產權貿易資訊。

Systems and Methods for Ultrasonic Pulse Communication in Solid Substrates

詳細技術說明
Introduction Information exchange with ultrasonic pulses offers an energy efficient approach for event monitoring in wireless sensor networking. Since the purpose of this wireless sensor network is to detect the occurrence of a certain event, the information is binary in nature – a single ultrasonic pulse represents the detection of such an event. In contrast to this, traditional radio communication requires multiple bits, due to radio packet structure, to represent the same information. Hence, the traditional model of communication in wireless sensor networks for binary event detection is highly inefficient.  Description of Technology This technology is a generalized ultrasonic sensor node, small enough to be embedded into structural materials, which can communicate with neighboring nodes via ultrasound and can be programmed to monitor a specific component of the structure.  This technology can be used to create a network of generalized ultrasonic sensor nodes embedded in a construction material. The structural material could be fashioned into modular components. The nodes are embedded in a manner such that mechanically connecting the modules to one another results in a sensor network. Communication between nodes is achieved via mechanical wave propagation in solid substrates, using ultrasonic waves. Multi-hop pulse networking is applied in order to exchange information over large distances and an ultrasonic pulse compression mechanism is applied in order to reduce overhead.  Key BenefitsLower power consumptionNo overhead for network design and implementation Low cost ApplicationsEvent monitoring in wireless sensor networkingStructural health monitoringAircraft Wing monitoringBridge monitoring Patent Status Patent pending Inventors Subir Biswas, Stephan Lorenz, Bo Dong, Qiong Huo Tech ID TEC2013-0069
*Abstract
None
*Principal Investigation

Name: Subir Biswas, Professor

Department: Department of Electrical & Computer Engineering


Name: Stephan Lorenz, Doctoral Student

Department: Electrical and Computer Engineering


Name: Bo Dong, Student

Department: Electrical and Computer Engineering


Name: Qiong Huo, previously MSU studnet

Department: Electrical and Chemical Engineering

國家/地區
美國

欲了解更多信息,請點擊 這裡
移動設備