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Interfacial Convective Assembly for High Aspect Ratio Structures Without Surface Treatment

技術優勢

Value PropositionThe method:ΓÇóIs fast, effective, scalable and economical as compared to prior art techniquesΓÇóIs effective for assembly of nanoparticles on both hydrophobic and hydrophilic surfacesΓÇóEnables assembly of nanoparticles even on flexible and bendable substratesΓÇóEnables the prevention of evaporation and increased temperature as opposed to prior art proceduresΓÇóInvolves automatic convective flows due to liquid density differences, thereby avoiding use of other conventional requirementsΓÇóIs effectively used for assembling electronic and electrochemical systems such as nanowires, antennas, sensors, photonic devices, information storage medium, and display/optical and medical (e.g., drug release) devices on a commercial scale

詳細技術說明

None

*Abstract

Many nanoparticle assembly approaches such as convective assemblies, metal deposition methods (such as evaporation), and dip coatings have been used till date. However, these approaches are associated with possible limitations such as a poor selectivity, an increased temperature, and need of special vacuum systems in case of metal deposition; a long process time, and an application difficulty (especially for thin and bendable substrates) in case of dip coating; and a surface treatment requirement for convective assembly. This novel method involves an interfacial convective assembly of nanoparticles into high aspect nanostructures without using common prior art assembling requirements such as surface treatment, particle charge, electric current, and excess heat.

*Principal Investigation

Name: Ahmed Busnaina

Department:

Name: Nam-Goo Cha

Department:

Name: Yolanda Ehegoyen

Department:

Name: Taehoon Kim

Department:

國家/地區

美國