Method and Apparatus for Submicron Particulate Eviction
- 詳細技術說明
- None
- *Abstract
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The invention relates to the surgical cleaning of a semiconductor wafer through the inducement of cavitation on the surface of the waferat the location of an adherent particle. Cavitation is induced byfocusing two acoustic fields on the surface of the wafer. The twoacoustic fields include a cavitation field having relatively low frequencyfocused on the wafer surface from a direction perpendicular to thewafer and a coaxing field of relatively high frequency focused on the wafer surface form a direction between 0 and 25 degrees from thewafer surface.
- 國家/地區
- 美國
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