Thermal Interface Material - Thermal Silicon Clay
Thermal Interface Materials (TIM) is used to address a crucial problem with today's electronic devices: the need to dissipate the sizable amounts of heat being generated during operation. Good TIMs can ensure complete contact between the heat source and heat sink by means of high thermal conductivity and reduced contact resistance. NAMI has developed a series of thermal silicon clay with thermal conductivities ranging from 7 to 10W/mK. The silicon clay is softened during operation, which can further reduce the contact resistance between the interfaces, achieving the best gap filling performance.
- Comparable thermal conductivity with thermal pad (7-10W/mK)
- Further reduction in contact resistance during operation
- Re-workable
- High dielectric withstand (>8kV/mm)
- Telecommunication systems
- Network servers and computers
- New energy-thermal management system
