Composition for photoimaging
- 總結
- An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.
- 技術優勢
- Photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns.
- 合作類型
- This patent is made available for free use by all, except when another provider attempts to enforce a patent in an EPC class against the provider or when a non-provider attempts to enforce any patent against the provider.
- 覆蓋範圍
- Other
- 商品和服務
- Waste management > Pollution control
- ID號碼
- US6576382
欲了解更多信息，請點擊 這裡
