亞洲知識產權資訊網為知識產權業界提供一個一站式網上交易平台，協助業界發掘知識產權貿易商機，並與環球知識產權業界建立聯繫。無論你是知識產權擁有者正在出售您的知識產權，或是製造商需要購買技術以提高操作效能，又或是知識產權配套服務供應商，你將會從本網站發掘到有用的知識產權貿易資訊。

返回搜索結果

Polymer-Bonded Magnetic Materials

總結

A magnetic composition for power conversion includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/mm2.

附加資料

Patent Number: US8277678B2
Application Number: US200839592A
Inventor: Cheng, Ka Wai Eric | Wong, Yuen Wah | Wu, Wei Tai | Ding, Kai | Ho, Yiu Lun | Cheung, Tsz Kong | Cheong, Chi Keong
Priority Date: 28 Feb 2008
Priority Number: US8277678B2
Application Date: 28 Feb 2008
Publication Date: 2 Oct 2012
IPC Current: H01F0001113 | H01F000137
US Class: 25206254 | 25206262
Assignee Applicant: The Hong Kong Polytechnic University
Title: Polymer-bonded magnetic materials
Usefulness: Polymer-bonded magnetic materials
Summary: A magnetic composition for forming magnetic core used for power conversion, useful for magnetic device including power ferrites, power transformer or power inductor (claimed).
Novelty: Magnetic composition for forming magnetic core used for power conversion, useful for magnetic device including power ferrites, power transformer or power inductor, comprises thermoplastic polymer and magnetic powders

主要類別

化工/材料

細分類別

化工/材料應用

申請號碼

US200839592A

其他

CHENG Ka Wai Eric
WONG Yuen Wah
WU Wei Tai
DING Kai
HO Yiu Lun
CHEUNG Tsz Kong
CHEONG Chi Keong

國家/地區

美國

欲了解更多信息，請點擊這裡