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Method and apparatus for measuring amount of material removed from target in pulsed laser ablation

總結: This new technology is very important for manufacturing industries such as thin film, electronic and optical devices, and solar panels. The present patent application is directed to a method and an apparatus for measuring the amount of material removed from a target in pulsed laser ablation.

技術優勢: Inexpensive method with mass sensitivity down to tens of pico-gram and compatible with ambient air

技術應用: Manufacturing of thin film and electronic devices, solar panels, optical devices

詳細技術說明: A method for measuring the amount of material removed from a target in pulsed laser ablation is provided. The method includes generating a laser beam with a laser generator for ablating the target; driving the laser generator with a delay generator; acquiring the acoustic signal generated when the target is being ablated by the laser beam and generating an electrical signal accordingly with a microphone; amplifying the electrical signal generated by the microphone with a pre-amplifier; displaying an acoustic waveform indicating the intensity of the acoustic signal generated when the target is being ablated by the laser beam with a digital oscilloscope connected to the delay generator and the pre-amplifier; and deducing the amount of material removed from the target in the pulsed laser ablation according to the acoustic waveform in real time. An apparatus for performing the method is also provided.

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