Pulse Electroplating Process
- 總結
- A Process Is Provided For Obtaining Crack-Free Deposits Of Rhodium By A Pulse Electroplating Process.
- 附加資料
- Patent Number: US4789437A
Application Number: US1986884706A
Inventor: Sing, Miu W. | Sing, Fung Y.
Priority Date: 11 Jul 1986
Priority Number: US4789437A
Application Date: 11 Jul 1986
Publication Date: 6 Dec 1988
IPC Current: C25D000104 | C25D000350 | C25D000518
US Class: 205076 | 204012 | 204DIG9 | 205104 | 205264 | 204047
Assignee Applicant: The University of Hong Kong
Title: Pulse electroplating process
Usefulness: Pulse electroplating process
Novelty: Electroplating deposits of rhodium using pulse current in an electrolyte contg. rhodium sulphate and sulphuric acid
- 主要類別
- 電子
- 細分類別
- 半導體
- 申請號碼
- US1986884706A
- 國家/地區
- 香港
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