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Improvement in the Percolation Efficiency of the Conductivity of Electrically Conductive Adhesives

總結

This is a method which is efficient in improving the percolation efficiency of the electrically conductive adhesives (ECAs). We apply a series of halogens and pseudohalogens for surface pre-modification of the conductive fillers. This treatment can result in the formation of a thin layer of nano-islands at the surface of the metal fillers. These nano-islands are the complexes of metal halides with abundant metal molecular clusters. The size range of these nano-islands is from 0.5 nm to 1 micrometer. They can improve the wettability between the filler and the resin matrix by adjusting the polarity of the metal filler surface. They can also prevent oxidation of the metal filler surface by oxygen, because the abundant metal clusters inside the nano-islands have very strong reducing ability. This treatment method affiliates the electrical conductance of the ECAs.

技術優勢

1. An efficient method to improve the conductivity of the electrically conductive adhesives and lowers the percolation threshold.
2. Can have less filling materials (usually are noble metals) to achieve excellent conductivity

技術應用

- Electronic packaging industry
- Logistic industry
- Military industry

附加資料

Patent Number: CN101602929B
Application Number: CN200910142305A
Inventor: XU, Bing | YANG, Cheng | YUAN, Ming-hui
Priority Date: 27 May 2008
Priority Number: CN101602929B
Application Date: 27 May 2009
Publication Date: 13 Feb 2013
IPC Current: C09J020100 | C09C000162 | C09C000306 | C09C000308 | C09J000902 | C09J001104 | C09J016300 | C09J017904 | C09J017908 | C09J018304
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Percolation efficiency of the conductivity of electrically conductive adhesives
Usefulness: Percolation efficiency of the conductivity of electrically conductive adhesives
Summary: In interconnection technologies selected from surface mount technology (SMT), chip scale package (CSP), pin-through-hole (PTH), ball grid array (BGA), flip chip technology and stencil printing technology.
Novelty: Electroconductive bonding material formed as modified electrically conductive adhesive comprises thermoplastic polymer resin matrix, and conductive filler material embedded within the matrix and modified by applying halogen/pseudohalogen

主要類別

紡織/服裝

細分類別

織品工程

申請日期

27 May 2009

申請號碼

Chinese 200910142305.5

專利信息

Chinese ZL200910142305.5

ID號碼

TTC.PA.384

國家/地區

香港