Inorganic Aqueous Solution (IAS) for Phase-Change Heat Transfer Medium
Can be used with Al without generating NCG (after 9 weeks of continuous testing) Lighter heat transfer pipes (compared to Cu) Desirable operating temperatures (-25 ˚C to 200 ˚C) Long-term stability Can be extended to other water-incompatible materials
Researchers led by Professor Ivan Catton have invented a novel IAS media that can be used with Al heat transfer pipes. This invention is lightweight and is a more efficient heat transfer method that operates at desirable temperatures (‑25 ˚C – 200 ˚C) using non-toxic components with long-term stability and lower failure risk due to NCG formation. This innovative device was shown to have a lifetime compatibility and to effectively resist NCG formation after more than nine weeks of continuous testing. Potentially, this technology can be expanded to work with other water-incompatible materials.
Patent Number: WO2013169400A1
Application Number: WO2013US32703A
Inventor: CATTON, Ivan | TAO, Huishu, Thomas | REILLY, Sean, W. | AMOUZEGAR, Ladan | YAO, Qi | STUBBLEBINE, Michael | SUPOWIT, Jacob
Priority Date: 11 May 2012
Priority Number: WO2013169400A1
Application Date: 15 Mar 2013
Publication Date: 14 Nov 2013
IPC Current: C09K000510
Assignee Applicant: The Regents of the University of California
Title: INORGANIC AQUEOUS SOLUTION (IAS) FOR PHASE-CHANGE HEAT TRANSFER MEDIUM | SOLUTION AQUEUSE INORGANIQUE POUR MILIEU DE TRANSFERT THERMIQUE À CHANGEMENT DE PHASE
Usefulness: INORGANIC AQUEOUS SOLUTION (IAS) FOR PHASE-CHANGE HEAT TRANSFER MEDIUM | SOLUTION AQUEUSE INORGANIQUE POUR MILIEU DE TRANSFERT THERMIQUE À CHANGEMENT DE PHASE
Summary: The solution is useful in phase-change heat transfer device (claimed).
Novelty: Inorganic aqueous solution used in phase-change heat transfer device, comprises strong oxidizer ion, passivation component, coating ion, electron balancing component and water
纺织/服装
织品工程
State Of Development IAS media that is compatible with Al devices has been developed. Lifetime testing results with different Al materials has been studied and been shown to effectively resist NCG formation after more than nine weeks of continuous testing. Applications Background Heat pipes, which transfer heat between a heat source and a heat sink, are an effective way to manage heat generated by electronics, regenerators in electrical power plants, aircraft carrier decks, and satellites. Copper (Cu) is commonly used due to its high thermal conductivity, water compatibility, and wide availability. For space applications, which require lightweight materials, Al is used instead since it is three times less dense than Cu. However, Al is water incompatible and this combination causes heat pipe failure due to the formation of non-condensable gas (NCG), or hydrogen gas. Although ammonia has been used in Al heat pipes, it is unideal as it can only operate from ‑60 ˚C to 100 ˚C and does not have the operation range of water (‑25 ˚C – 200 ˚C). Other attempts reduce NCG formation with Al pipes by using IAS to passivate the Al surface, but these methods lack continuous protection and long-term stability. Related Materials M. Stubblebine, S. Reilly, Q. Yao, and I. Catton. Use of an Inorganic Aqueous Solution to Prevent Non-Condensable Gas Formation in Aluminum Heat Pipes. Proceedings of the ASME 2013 Heat Transfer Summer Conference. 2013. Tech ID/UC Case 23455/2012-426-0 Related Cases 2012-426-0
Q. Yao, M. Stubblebine, S. Reilly, L. Amouzegar, and I. Catton. Using an Inorganic Aqueous Solution (IAS) in Copper and Aluminum Phase Change Heat Transfer Devices. Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. 2013.
A. Karimi, S. Reilly, and I. Catton. Enhanced Performance of a Thermal Ground Plane Utilizing an Inorganic Aqueous Solution. 14th IEEE ITHERM Conference. 2014.
M. Stubblebine and I. Catton. Passivation and Performance of Inorganic Aqueous Solutions in a Grooved Aluminum Flat Heat Pipe. Journal of Heat Transfer. 2015.
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