Monolithic Integration of Ultra-Scaled High Performance Pin-Size Wearable Electronics
This invention integrates sensors with amplifying and processing electronics and paves the way for integrating thin film batteries, gas, ion, radiation, and other types of sensors for larger scale applications. In addition, this invention can incorporate interactive displays composed of transparent layers, pressure sensors and read-out electronics, all on a flexible substrate. Commercial applications include “wearables” such as seamless pin-size smart skin mounts, jewelry, watches, clothes, or flexible displays. One target market is clinical patients wearable smart skin for athletes, smart phones, iPads and interactive electronics in general. Further details are available under a non-disclosure agreement. Worldwide rights available for licensing.
Engineers from UC San Diego have developed a seamless, compact and non-intrusive, high-sampling-speed biomedical sensor for health monitoring. The invention encompasses a novel system integration method of multi-modal, ultra-thin and highly integrated electronic sheets that can record from the human skin, process, and transmit electrophysiological data for medical purposes. This electrophysiological sensor with readout circuitry on ultra-thin flexible substrates technology is pin-sized. This is accomplished in a newly developed heterogeneous integration process in the inventors’ laboratories in which multi-functional and multi-layered devices are monolithically integrated onto a single handle substrate, and upon completion of the integrated system, the handle substrate is removed (see related technology 2015-074.) This unique approach improves upon the conventional devices because it can incorporate and integrate multiple circuit components without the need for wafer/bump bonding of discrete components and the resultant loss of resolution and performance during the bonding process, a typical problem in existing art.
20180040649
Related Technologies Tech ID/UC Case 25044/2015-076-0 Related Cases 2015-076-0, 2015-208-0
美国
