Integration Of Advanced Structures With Conventional Integrated Circuits
- 技术应用
- Connections within processor chips, connections between microprocessor chips, connections between circuit boardsLower processing temperatures, facilitates alignment across interconnects, better integration with existing silicon-based circuitry
- 详细技术说明
- None
- *Abstract
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Technological advances have allowed computer microprocessors to handle data at an extraordinary rate. However, the electrical interconnects within and between microprocessor chips introduce a severe bottle-neck to the flow of data. A promising architecture for next generation interconnects is high-speed and high-bandwidth optical interconnects, which will require heterogeneous integration of compound semiconductors with Si technologies. Some previously-explored methods for creating the optoelectronic circuitry include epitaxial growth, heteroepitaxial growth, and wafer-bonding. However, epitaxial growth of interconnections can produce large physical mismatches between desirable compound semiconductors and silicon; heteroepitaxial growth is complicated, expensive, and requires high processing temperatures that damage silicon-based circuitry; and wafer bonding is extremely susceptible to misalignments.
Researchers at the University of California, Berkeley are developing advanced structures and methods for integration of compound semiconductors with conventional integrated circuit components to produce various active and passive optoelectronic components for optical interconnects, sensors, semiconductor lasers and other devices. The structures can accommodate quantum wells or quantum dots. The method under development at Berkeley will eliminate problems with alignment and processing temperature that constrain the application of conventional methods for fabricating optoelectronic circuitry.
- *Principal Investigation
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Name: Connie Chang-Hasnain
Department:
Name: Chih-Wei 'Linus Chuang
Department:
Name: Nobuhiko Kobayashi
Department:
- 其他
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Tech ID/UC Case
17535/2005-100-0
Related Cases
2005-100-0
- 国家/地区
- 美国
