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Self-Assembly of Microscale Parts Using Integrated Micromagnets

标题

Method And Structure For Magnetically-Directed, Self-Assembly Of Three-Dimensional Structures

详细技术说明

None

*Abstract

Invention

This alternative magnetic assembly system integrates the magnets onto micro part surfaces to enable self-assembly. Over the past few decades, electronics and photonic devices have increased in complexity as they have become more integrated. This trend toward more compact and integrated devices has challenged conventional assembly processes that rely heavily on human and robotic manipulation. Available assembly procedures for microscale electrical components are limited by cost and in speed and throughput for high volume production. Moreover, as part sizes continue to decrease, conventional component manipulators are incapable of the precision required for microscale and nanoscale fabrication.

Researchers at the University of Florida have developed a microscale assembly procedure that uses batch-fabricated, thin-film magnets integrated onto the micro part surfaces to enable precise self-assembly at high throughput. This system will aid the development of advanced electronics, such as micro batteries and multi-chip microsystems, revolutionizing electronic engineering.

Applications

Magnetic self-assembly of microscale parts that improve the fabrication of multi-chip microsystems, including RFID tags, microbatteries, MEMS, power systems, and electro-optics

Advantages

• Satisfies precision requirements of microscale technologies, eliminating the random errors posed by conventional assembly methods
• Removes the need for human or robotic manipulation during assembly, reducing product manufacturing costs
• Enables high volume, low-cost manufacturing of complex devices, increasing market infiltration and providing huge profit potential
• Incorporates easily into existing assembly processes, improving microsystem fabrication while minimizing capital investment

Technology

This magnetic self-assembly of multi-chip microsystems uses miniaturized magnets integrated into the surfaces of microscale parts. The integrated magnets cause chips to bind to one another in a predetermined configuration. The micromagnets integrate easily into the chips at the wafer lever using standard, low-cost, back-end microfabrication processes. The process is very amenable to flip-chip bonding, self-packaged devices, stacked dies, thinned dies, and other devices requiring complex microassembly. During self-assembly, the micromagnets align and hold the parts in place for subsequent heating of solder bumps or other die-attach epoxies.

*IP Issue Date

Mar 20, 2012

*IP Publication Date

Sep 11, 2008

*Principal Investigation

Name: David Arnold

Department:

附加资料

Inventor: Arnold, David Patrick | Shetye, Sheetal Bhalchandra
Priority Number: US8586410B2
IPC Current: H01L002150
US Class: 438107 | 257E25001 | 257E2503 | 438108
Assignee Applicant: University of Florida Research Foundation Inc.inesville
Title: Enhanced magnetic self-assembly using integrated micromagnets
Usefulness: Enhanced magnetic self-assembly using integrated micromagnets
Summary: Method for magnetically-directed self-assembling parts of microfabricated devices on a scale. Uses include but are not limited to a nanoscale, micron scale, millimeter scale and a centimeter scale.
Novelty: Method for magnetically-directed self-assembling parts of microfabricated devices on e.g. nanoscale, involves mixing body with another body with mixing force, where bodies are bonded together by magnetic attraction force

主要类别

电子

细分类别

电路设计

申请日期

Apr 14, 2008

申请号码

8,138,868

其他

国家/地区

美国