High Density 3D Stacked RRAM Cache Designs
Purdue University researchers have designed a memristor that stacks more crossbars for the same amount of space, allowing its density to be nearly doubled. This design sets the next generation in energy density and proves itself as an interesting design alternative because of its higher energy density and the dynamic insulator's thickness equivalent to three memristor layers. Since the number of crossbars is fewer for the new, extrapolated design, the power dissipation on the crossbars is expected to be reduced compared to conventional design. Field-programmable gate arrays (FPGAs) would greatly benefit from this design due to their need for large amounts of programmed data.
Reduced footprint and increased storage capacity
High computer memory densityImplantable devicesField-programmable gate arrays (FPGAs)ComputersElectrical Circuits
Selva Vadivel MuruganPurdue Information Technology
United States
N/A
美国
