SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF
- 总结
- A semiconductor element and a manufacturing method thereof are provided. The semiconductor element includes a substrate and multiple semiconductor chips disposed thereon. The semiconductor chips are arranged to form multiple sequentially nested circle(s), and a circumference of each of which is arranged with multiple the semiconductor chips. The numbers of the semiconductor chips arranged on the respective circumferences of the sequentially nested circle(s) from inside to outside are gradually increased, and distances among the circumferences are gradually decreased from inside to outside.
- 技术优势
- The disclosure can slow down aging and failure of the semiconductor chips and improve heat dissipation performance and light emitting effect of product.
- 技术应用
- Lighting
- 申请日期
- 2016-12-26
- 申请号码
- US15/390555
- 分类
- H01L33/64 | H01L25/075 | H01L33/62 | H01L33/48
- 覆盖范围
- 封装模组
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