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3-D Monitoring of plasma etch endpoint using laser hologram


总结

This sensor system is composed simply of a laser, charge couplded device, and a beam expander. Laser holograms store all the interactions between plamsa and laser particles. The system is based on new concepts of light. The energy distributions extracted from laser holograms at multiple wafer places are traced to detect etch endpoints. No existing sensors can do this.


技术优势

This sensor can be used for real-time monitoring of etch endpoints during the etching of thin films at multiple positions across the wafer. Major users of this system are the makers of chips or display.


申请号码

WO2014038827


覆盖范围

USA


商品和服务

Sale, License agreement


专利信息

Issued patent


国家/地区

南韩

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