Media.Player

Method of Preparing Fine-Pitch Electroplated Solder Bumping for Flip-Chip微細間距倒裝銲凸點電鍍製備技術

总结

Electroplating-based flip chip solder preparation process had been widely used over other preparation methods. Although it is cheaper and is able to achieve the material deposition on the fine pitch I/O pads, the solder bumps resulted are not uniform and not quality-guaranteed.

In this invention, manufacturing of fine-pitch solder bumps on the wafers is made possible. It can achieve solder bumps manufacturing with 50microns space. The solder bump size is from 50 to 300microns. The solder materials will not collapse on the surface of wafers during the reflow process because of a specially designed layer. Series of photolithography process including the designing method of related photolithography mask can achieve the high quality and thick photoresist. The parameters of electroplating process and the process designed are also provided to improve the quality of solder and eliminate the IMC effect.

技术优势

1. High quality and thick photoresist (50-175microns)
2. Improved quality of Cu and solder
3. Elimination of IMC effect
4. Photolithography process is improved
5. Lower cost

技术应用

- Solder bumping process
- Electronic product packaging application
- Wafer bumping production

附加资料

Patent Number: HK1070927A1
Application Number: HK2005103510A
Inventor: CHAN PHILIP CHING HO | XIAO DAVID GUOWEI
Priority Date: 31 May 2003
Priority Number: HK1070927A1
Application Date: 25 Apr 2005
Publication Date: 10 Aug 2007
IPC Current: C25D000712 | H01L002144 | H01L002160 | H01L002302 | H01L0023485
Assignee Applicant: The Hong Kong University of Science & Technology
Title: Method of preparing fine-pitch electroplated solder bumpoing for flip-chip
Usefulness: Method of preparing fine-pitch electroplated solder bumpoing for flip-chip

主要类别

电子

细分类别

半导体

申请日期

25 Apr 2005

申请号码

Hong Kong 05103510.0

专利信息

Hong Kong HK1070927

ID号码

TTC.PA.211S

国家/地区

香港